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Heat Sink Compounds
Viscous fluid which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components. In electronics, it is often used to aid a component's thermal dissipation via a heat sink.
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ARCTIC MX-4 (4 g) Edition 2019 – High Performance Thermal Paste
4 g, 8.5 W/mK, 2.50 g/cm³, 3.8 x 1013 Ω-cm, 11.8 gSKU: ACTCP00002B