Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

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In stock
Heatsink thermal paste grease, 3 g weight
SKU
TG-G3.0-01
UNSPSC: 32131008
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
Features
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Product colourGrey
Technical details
Compliance certificatesRoHS
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Weight & dimensions
Width120 mm
Depth180 mm
Height15 mm
Weight3 g
Package width380 mm
Package depth390 mm
Package height280 mm
Package weight3.6 kg
Packaging data
Package width380 mm
Package depth390 mm
Package height280 mm
Package weight3.6 kg
Operational conditions
Operating temperature (T-T)-50 - 240 °C
Colour
Product colourGrey
SKU TG-G3.0-01
EAN 8716309083133
Specification
Features
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Product colourGrey
Technical details
Compliance certificatesRoHS
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Weight & dimensions
Width120 mm
Depth180 mm
Height15 mm
Weight3 g
Package width380 mm
Package depth390 mm
Package height280 mm
Package weight3.6 kg
Packaging data
Package width380 mm
Package depth390 mm
Package height280 mm
Package weight3.6 kg
Operational conditions
Operating temperature (T-T)-50 - 240 °C
Colour
Product colourGrey
Manufacturer Gembird
In Stock Y