HyperX FURY HX432C16FB3K4/128 memory module 128 GB 4 x 32 GB DDR4 3200 MHz

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In stock
4 x 32GB, 3200MHz, CL16, XMP
SKU
HX432C16FB3K4 128
UNSPSC: 43201402
Unleash your FURY.

HyperX® FURY DDR4 auto-overclocks itself to the highest published frequency, up to 3466MHz*, providing a Plug N Play boost for gaming, video editing, and rendering. FURY DDR4 is XMP-ready and available in 2400MHz–3466MHz speeds, CL15–16 latencies, single module capacities of 4GB–16GB, and kit capacities of 16GB–64GB. It features Plug N Play automatic overclocking at 2400MHz and 2666MHz speeds and is compatible with the latest Intel and AMD CPUs. HyperX FURY DDR4 stays cool with its stylish, low-profile heat spreader. 100% tested at speed and backed by a lifetime warranty, FURY DDR4’s your worry-free, cost-effective upgrade of choice.

- Updated low-profile heat spreader design
- Cost-efficient, high-performance DDR4 upgrade
- Intel XMP-ready profiles optimized for Intel’s latest chipsets
- Available in fast speeds up to 3466MHz*
- Plug N Play functionality at 2400MHz and 2666MHz

* HyperX PnP memory will run in most DDR4 systems up to the speed allowed by the manufacturer's system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturer's BIOS. AMD Ryzen systems will boot at the JEDEC default speed/latency with FURY. In order to enable the factory overclock speed and latency, Profile 1 must be selected in the BIOS.
Power
Memory voltage1.2 V
Design
Product colourBlack
Cooling typeHeatsink
CertificationCE
JEDEC standardYes
Technical details
Product colourBlack
Country of originChina
Cooling typeHeatsink
Memory
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version2.0
Memory layout (modules x size)4 x 32 GB
Internal memory128 GB
Component forPC/Server
Memory form factor288-pin DIMM
CAS latency16
Memory voltage1.2 V
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
ECCNo
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
Features
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version2.0
Product colourBlack
Memory layout (modules x size)4 x 32 GB
Internal memory128 GB
Component forPC/Server
Memory form factor288-pin DIMM
CAS latency16
Memory voltage1.2 V
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Country of originChina
Cooling typeHeatsink
CertificationCE
ECCNo
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
JEDEC standardYes
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Certificates
CertificationCE
Weight & dimensions
Package width25.4 mm
Package depth95.2 mm
Package height171.4 mm
Width7.2 mm
Depth133.3 mm
Height34.1 mm
Weight144.2 g
Package weight191.2 g
Packaging data
Package width25.4 mm
Package depth95.2 mm
Package height171.4 mm
Package weight191.2 g
Logistics data
Master (outer) case width203.2 mm
Master (outer) case length311.1 mm
Master (outer) case height101.6 mm
Master (outer) case gross weight2.12 kg
Other features
Country of originChina
SKU HX432C16FB3K4 128
EAN 0740617302660
Specification
Power
Memory voltage1.2 V
Design
Product colourBlack
Cooling typeHeatsink
CertificationCE
JEDEC standardYes
Technical details
Product colourBlack
Country of originChina
Cooling typeHeatsink
Memory
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version2.0
Memory layout (modules x size)4 x 32 GB
Internal memory128 GB
Component forPC/Server
Memory form factor288-pin DIMM
CAS latency16
Memory voltage1.2 V
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
ECCNo
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
Features
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version2.0
Product colourBlack
Memory layout (modules x size)4 x 32 GB
Internal memory128 GB
Component forPC/Server
Memory form factor288-pin DIMM
CAS latency16
Memory voltage1.2 V
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Country of originChina
Cooling typeHeatsink
CertificationCE
ECCNo
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
JEDEC standardYes
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Certificates
CertificationCE
Weight & dimensions
Package width25.4 mm
Package depth95.2 mm
Package height171.4 mm
Width7.2 mm
Depth133.3 mm
Height34.1 mm
Weight144.2 g
Package weight191.2 g
Packaging data
Package width25.4 mm
Package depth95.2 mm
Package height171.4 mm
Package weight191.2 g
Logistics data
Master (outer) case width203.2 mm
Master (outer) case length311.1 mm
Master (outer) case height101.6 mm
Master (outer) case gross weight2.12 kg
Other features
Country of originChina
Manufacturer HyperX
In Stock Y