Kingston Technology KSM26SED8/32ME memory module 32 GB 1 x 32 GB DDR4 2666 MHz ECC

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32GB, DDR4, 2666MHz, ECC, CL19, X8, 1.2V, Unbuffered, SODIMM, 260-pin, 2R, 16Gbit
SKU
KSM26SED8/32ME
UNSPSC: 43201402
Kingston's KSM26SED8/32ME is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) w/ parity, 2Rx8, ECC, memory module, based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 260-pin SODIMM uses gold contact fingers.
Power
Memory voltage1.2 V
Design
JEDEC standardYes
Memory
Buffered memory typeUnregistered (unbuffered)
Memory layout (modules x size)1 x 32 GB
Internal memory32 GB
Component forPC/Server
Memory form factor260-pin SO-DIMM
CAS latency19
Memory voltage1.2 V
Lead platingGold
Module configuration4096M x 72
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
ECCYes
Memory clock speed2666 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
Features
Buffered memory typeUnregistered (unbuffered)
Memory layout (modules x size)1 x 32 GB
Internal memory32 GB
Component forPC/Server
Memory form factor260-pin SO-DIMM
CAS latency19
Memory voltage1.2 V
Lead platingGold
Module configuration4096M x 72
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
ECCYes
Memory clock speed2666 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
JEDEC standardYes
Harmonized System (HS) code84733020
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Technical details
Compliance certificatesRoHS
Weight & dimensions
Width69.6 mm
Depth3.7 mm
Height30 mm
Logistics data
Harmonized System (HS) code84733020
Other features
Harmonized System (HS) code84733020
SKU KSM26SED8/32ME
EAN 0740617312249
Specification
Power
Memory voltage1.2 V
Design
JEDEC standardYes
Memory
Buffered memory typeUnregistered (unbuffered)
Memory layout (modules x size)1 x 32 GB
Internal memory32 GB
Component forPC/Server
Memory form factor260-pin SO-DIMM
CAS latency19
Memory voltage1.2 V
Lead platingGold
Module configuration4096M x 72
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
ECCYes
Memory clock speed2666 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
Features
Buffered memory typeUnregistered (unbuffered)
Memory layout (modules x size)1 x 32 GB
Internal memory32 GB
Component forPC/Server
Memory form factor260-pin SO-DIMM
CAS latency19
Memory voltage1.2 V
Lead platingGold
Module configuration4096M x 72
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
ECCYes
Memory clock speed2666 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
JEDEC standardYes
Harmonized System (HS) code84733020
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Technical details
Compliance certificatesRoHS
Weight & dimensions
Width69.6 mm
Depth3.7 mm
Height30 mm
Logistics data
Harmonized System (HS) code84733020
Other features
Harmonized System (HS) code84733020
Manufacturer Kingston Technology
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In Stock Y