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This CPU heat sink is designed for certain Supermicro X12 generation systems equipped with 3rd Generation Intel Xeon Scalable Processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance.
Performance | |
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Suitable location | Processor |
Thermal Design Power (TDP) | 270 W |
Type | Heatsink/Radiatior |
Supported processor sockets | LGA 4189 |
Compatible processor series | Intel® Xeon® |
Design | |
Product colour | Black, Stainless steel |
Certification | Supermicro |
Technical details | |
---|---|
Thermal Design Power (TDP) | 270 W |
Type | Heatsink/Radiatior |
Supported processor sockets | LGA 4189 |
Compatible processor series | Intel® Xeon® |
Compliance certificates | REACH, RoHS |
Power | |
Thermal Design Power (TDP) | 270 W |
Colour | |
Product colour | Black, Stainless steel |
Certificates | |
Certification | Supermicro |
SKU | SNK-P0077PW | ||||||||||||||||||||||||||||||||||||||||||
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EAN | 0672042416721 | ||||||||||||||||||||||||||||||||||||||||||
Specification |
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Manufacturer | Supermicro | ||||||||||||||||||||||||||||||||||||||||||
In Stock | Y |